data, data space, data sharing, data government and management, data connections, supply chain collaboration by fair sharing the data
Topic 1: The way towards sustainable and resilient food systems
Topic1: Change the way we connect and govern food systems
Designing, testing and scaling the deployment of digital technologies sustaining food system
resilience and green transition (big data, AI, innovative data sets, information exchange models,
transparency, flexible production systems etc.).
Impact: Data sharing as tool for helping supply chain collaboration on EU data spaces by fair data management and sharing tools
CENTRIA as partner:
Centria has been an active member of ARTEMIS/ECSEL/KDT/CHIPS family since 2012 with 6 projects, including many WP, demonstration and national coordinator roles. Furthermore, many Horizon projects, one of which Centria currently coordinates has supplemented the capacity of Centria as a seasoned RTO actor.
There are 150 researchers working in Centria R&D department, running 120 projects with a volume of about 10M€ today. Centria also hosts Rural Industry DIH with a special focus on the development of rural livelihoods and agricultural digitalization. The main research themes cover Agritech, communication, energy harvesting, software security, but also agricultural/industrial robotics (drones in particular), public security, biogas and renewable energies as well as AI and algorithms.
Centria also provides test and consultancy services for companies with 2M€ annual turnover. These testing facilities will be provided to project activities. See more information here: https://net.centria.fi/en/rdi/development-and-training-services/development-services/product-development-services/
In addition, Centria has an own 5G test network with a mobile standalone BS with high-performance MEC features. This can be used in the project as well for coverage tests according to the needs.
Similarly, there is a comprehensive fleet of UAV/UGV/UUV units of different sizes and functions, that can be used in the project according to the needs.
Lastly, 3D and electronics printers, scanners and laser cutting devices are available for constructing components and enclosures for the project.